Tessolve
高管
查看带有其 22 名主要高管的组织结构图
Tessolve 搜索最多的简介
- Srinivas Chinamilli, Co-Founder and Chief Executive Officer
- Rajesh Vaddempudi, Vice President, Test Engineering
- Nikhil Rajpal, Chief Executive Officer, Hero Electronix
高管在Tessolve变化
- Girish Wagle已作为Senior Vice President of Embedded Sales and Business Development加入公司 (新闻发布的2024十月29号).
- Sarit Das 曾任 Director, Business Finance, 现升职为 Senior Director, Finance (新闻发布的2024十月29号).
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跟踪 Tessolve 的高管变动
半导体
Tessolve 拥有 643 家竞争者，其中包括 Nvidia (美国(美洲))、Intel (美国(美洲)) 和 AMD (美国(美洲))。
Popular M&A news in 半导体
- SandboxAQ 刚刚宣布为 300 筹款数百万美元。 (公布2024十二月20号).
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- MatX 刚刚宣布为 80 筹款数百万美元。 (公布2024十一月25号).
半导体 行业的其他推荐联系人
消息
Tessolve 的最新新闻稿
- Tessolve CEO Srini Chinamilli Shares Insights with TechGig on Semiconductor Trends and Talent Expansion
- Tessolve’s PCB Design Team Wins Prestigious Siemens Xcelerator Technology Innovation Award
- Tessolve Recognized in Everest Group’s 2024 Semiconductor Engineering Services PEAK Matrix® Assessment
- Tessolve Welcomes Girish Wagle as Senior Vice President of Embedded Sales and Business Development
- Tessolve Re-Certified as a Great Place to Work
- Our CEO Highlights AI Chip Development and India’s Semiconductor Ecosystem in Digit Feature
- Our CEO Highlights Key Traits for Engineering Success in People Matters Interview
- Tessolve Earns Prestigious Functional Safety Process Certification (FS ISO 26262)
- Tessolve Expands with New Office in Hubli, Karnataka
- Tessolve's CFO Discusses 20 Years of Growth and Future Innovations with BISInfotech
- View more press releases Close
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